The Assembly Solutions division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will introduce its sintering process solutions at PCIM Asia at the Shenzhen World Exhibition Center in Shenzhen, China from September 9-11, 2021.

MacDermid Alpha will highlight its range of ALPHA Argomax sintering process solutions which includes engineered sinter materials and unique processes to address all possible design implementations for power electronics. The technology is an ideal solution that enables die attach sinter, top attach sinter, package attach sinter and wafer lamination attach sinter. ALPHA Argomax is available in paste, film and preforms.

In addition, Wilson Wu, Senior CTS Manager – NBD for MacDermid Alpha, will present on “Automotive Traction Module Attach by Silver Sintering – Process, Performance & Reliability” at the Power Electronics Application Technology Forum. With sintered silver replacing solder for die attach, the bottleneck for further inverter reliability and overall thermal improvement is shifting to heat sink level. In this forum, Wilson will introduce a novel large area dispense process for silver sintering paste application that is particularly well suited for larger transfer-molded power packages. He will define the process steps (drying and sintering) and present the results of assembly characterization by die shear, acoustic microscopy, and thermal shock reliability.

Power Electronics Application Technology Forum
Topic: Automotive Traction Module Attach by Silver Sintering – Process, Performance & Reliability
Speaker: Wilson Wu, Senior CTS Manager – NBD
Date/Time: September 10 / 2:10pm - 2:30pm
Venue: Booth F30, Hall 11, Shenzhen World Exhibition Center, Shenzhen, China

For additional information about MacDermid Alpha's latest sintering technologies and products, please visit Booth #D46 at PCIM Asia, or visit MacDermidalpha.com